Ultra-fine Solder Powder

    Huijin’s unique atomizing and classifying technologies ensure to produce high quality of ultrafine solder powders. All of the advanced properties of Huijin’s normal size solder powders are further carried forward in the ultrafine products, such as low impurities, low oxide, smooth surface, excellent stability, and precise particle size distribution.

    The most distinguishing features of Huijin’s ultrafine size solder powders products are: lower oxide, smooth surface and excellent stability. The particle surface maintains the original of the as atomized pattern. No damage impacts the particle surface during classifying. This makes it possible for the customers to simplify the ultrafine solder paste technology. It also guarantees the ultrafine paste with potential higher activity in the reflow process and higher welding reliability.

 ●Powder Appearance

●Particle Size Distribution Specification

Grade	% of weight-nominal size
	Main size ³90%	Low size	Upper size	No large than
Type 5*	10~25μm	max 5% <10μm	Less than 5% >25μm	30μm
Type 6*	5~15μm	Max 5% <5μm	Less than 10% >15μm	20μm
Type 7*	2~12μm	Max 1% <2μm	Less than 10% >12μm	16μm
Type 8*	2~8μm	Max 1% <2μm	Less than 10% >8μm	11μm

 

●Oxygen Content

Alloy	Sizegrade	Total Oxygen Content，ppm	Typical Total OxygenContent Range，ppm	Referenced Oxide Content，wt%
SAC0307 SAC 105 SAC 305 SAC 405	Type 5	<150 PPM	90~130	0.06~0.15
	Type6	<250 PPM	150~200	0.08~0.18
	Type7	<300 PPM	180~250	0.10~0.25
	Type8	<300 PPM	200~250	0.15~0.25

        ****** Oxygen level of other similarly products can also be controlled within these ranges